Electronics Integration and Reliability (EILB) research group is now looking for students to summer internships in the following projects:

1. Thermal characterization for alternative silicon on insulator

During the internship, the student will conduct thermal characterization of aluminium nitride thin films using time domain thermoreflective method. Tasks may include sample preparation, measurements, and data analysis / interpretation. The student may also contribute to document the analysis workflow.

2. Nanofabrication and the transition from piezoelectric MEMS (Micro-Electro-Mechanical Systems) to NEMS (Nano-Electro-Mechanical Systems)

The primary focus of this internship is on advancing nanofabrication techniques and process development, aiming toward M/NEMS miniaturization improvements and the design of state-of-the-art piezoNEMS.

3. Environmental Impact Assessment of Electronics: A Comparative Analysis of Commercial Software and Internally Developed Tool

During the summer internship, the student will undertake a systematic comparative analysis, evaluating the environmental impact assessment capabilities of commercially available software and an internally developed tool. This analysis aims to assess a variety of electronic products and/or processes.

The positions are available for summer 2024 starting in June until August. The exact dates will be agreed with the chosen candidates. Summer internships are paid positions.

What we expect from you

The applicants are expected to have a background in a suitable field, such as: electrical engineering, control engineering, physics or related field. We also appreciate previous experience in one or some of the following areas: microfabrication, electronics and programming skills.

How to apply?

Please send your application as a single PDF file by 19.2.2024 at the latest through our recruitment system. You can access the recruitment system by clicking the “Apply now!” link below. Please indicate in your application which of the three positions are you primarily applying for.

Application material should include (all documents in English):

• Letter of motivation

• CV

• Transcripts
   

All applications should be submitted using the online application system. For further information about the positions, please contact Mervi Paulasto-Kröckel ([email protected]) or Vesa Vuorinen ([email protected]). In questions related to the recruitment process, HR partner Camilla Hanganpää ([email protected]) will be happy to help you.

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